Thanks for the comment. Would absolutely love feedback from Daniel. I think that advanced packaging, specifically 3D packaging, certainly has the potential for a high impact on memory bandwidth as well as power dissipation. With that said, I think the efficiency problem in AI hardware is being approached from several angles, where HW/SW co-design and novel deployment configurations also dictate how the compute changes over time.
Thanks for the comment. Would absolutely love feedback from Daniel. I think that advanced packaging, specifically 3D packaging, certainly has the potential for a high impact on memory bandwidth as well as power dissipation. With that said, I think the efficiency problem in AI hardware is being approached from several angles, where HW/SW co-design and novel deployment configurations also dictate how the compute changes over time.