At my level of understanding, thermal budget concerns and other manufacturing defects suggest single-layer 2D chips are the only commercially viable option, and there are a number of challenges when it comes to stacking 2D chips to make a 3D chip. Is there a reason to prefer 3D chips to a large collection of asynchronous 2D chips? Have I misunderstood the technical challenges involved? (Both?)
That might make a little more sense (until we get proper 3D chips).
At my level of understanding, thermal budget concerns and other manufacturing defects suggest single-layer 2D chips are the only commercially viable option, and there are a number of challenges when it comes to stacking 2D chips to make a 3D chip. Is there a reason to prefer 3D chips to a large collection of asynchronous 2D chips? Have I misunderstood the technical challenges involved? (Both?)
Increased dimensionality reduces signal distances—and so increases speed.
Brains illustrate the viability of the approach.
Ok- I agree with you that it would be a good solution to the packing problem but I don’t think the packing problem is the most relevant one.